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 Rigid Printed Circuits Board(RPCB)

        A RPCB substrate mainly uses CCL made from the lamination of glass fiber cloth and copper foil with fusion agents such as epoxy resin as the raw material, and after etching, plating, multilayer lamination makes a printed circuit board, which is an important electronic unit, the support of electronic components, and the provider of electrical connections of electronic components. 

1. Single Sided Rigid printed circuits board

        For a single-sided RPCB, traces of which are only on one side. Components concentrate on one side, while traces concentrate on the other side ( if there are SMT components, they will be on the same side as traces, while plug-in devices are on the other one), because single-sided board has many strict limits on the design of circuit.

        The basic layering, or “stack up” is as follows:


2. Double Sided Rigid printed circuits board

        A double-sided RPCB, whose area is one time larger than that of the single-sided one, for having solved the difficulties in staggered layout of single-sided RPCB, is more suitable for use in circuits that is more complex than single-sided RPCB.

        The basic layering, or “stack up” is as follows:


3. Multi-Layer Rigid printed circuits board

        A multilayer board, in order to increase the available area of layout, uses more single or double-sided layout boards. A RPCB, which is with a double-sided circuit board for lining, two single-sided ones for outer layer or two double-sided circuit boards for lining, two single-sided ones for outer layer, and bonded together alternately with insulation materials through positioning system, as well as the conductive pattern is interconnected according to the requirements of design, makes a multilayer printed circuit board. The number of layers is not necessarily mean there are the same number of independent layout layers, since empty layers will be added to control the thickness of board in exceptional circumstances. Usually the number of layers is even, and including the outermost two layers.

        The basic layering, or “stack up” is as follows:








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