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OEM/ODM

ACT is engaged in the circuit board assembly and test services and provide you with a one-stop all-around service experience.

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Process capability

Specifications of processing components are: LGA, CSP, BGA, QFP, TQFP, QFN, PLCC, SOT, SOIC, 1206, 0805, 0603, 0402, 0201.
Processing mode: PCB welding processing, Lead or Lead-free SMT processing, plug-in board processing, SMD processing, BGA welding, BGA bumping, BGA processing, chip packaging.  
       The smallest size of mounted components is 0201 with a precision of 0.1mm, which can mount PLCC, QFP, BGA, CSP and other devices with a pin spacing of 0.3 mm, and boards of higher levels such as ultra-thin PCB, Flexible PCB, reed (gold finger), etc., as well as can mount/insert / mixed TFT display driver board, Mobile phone motherboard, Battery protection circuit and other complex products.
Processing of plugins supplied by clients: Pure plugins assembly and welding
Single-sided SMT assembly: All SMT components are on one side of the PC
Double-sided SMT assembly: SMT components are respectively on A and B both sides of the PCB
Single-sided mixed processing: All plugins and SMT components are on the A side of PCB
Double-sided mixed processing: plugins and SMT components are on the A and B both sides of PCB

  



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